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Si5519DU
Vishay Siliconix
N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
N-Channel
V DS (V)
20
R DS(on) ( Ω )
0.036 at V GS = 4.5 V
0.063 at V GS = 2.5 V
I D (A) a Q g (Typ.)
6.0
5.4 nC
6.0
? Halogen-free
? TrenchFET ? Power MOSFETs
APPLICATIONS
RoHS
COMPLIANT
P-Channel
- 20
0.064 at V GS = - 4.5 V
0.095 at V GS = - 2.5 V
- 6.0
- 6.0
6.0 nC
? Portable DC-DC Applications
PowerPAK ChipFET Dual
1
D 1
S 2
S 1
2
8
D 1
D 1
G 1
S 2
3
4
G 1
G 2
7
D 2
G 2
Marking Code
6
5
D 2
EB
XXX
Lot Tracea b ility
and Date Code
S 1
D 2
Bottom V ie w
Part #
Code
N -Channel MOSFET
P-Channel MOSFET
Orderin g Information: Si5519DU-T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Source Drain Current Diode Current
T C = 25 °C
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
V DS
V GS
I D
I DM
I S
20
6.0 a
6.0 a
6.0 a, b, c
4.9 b, c
25
6.0 a
1.9 b, c
± 12
- 20
6.0 a
-
- 6.0 a
- 4.8 b, c
- 3.8 b, c
- 20
- 6.0 a
- 1.9 b, c
V
A
T C = 25 °C
10.4
10.4
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
6.6
2.27 b, c
6.6
2.27 b, c
W
T A = 70 °C
1.45 b, c
1.45 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Maximum Junction-to-Ambient b, f t ≤ 5s
Maximum Junction-to-Case (Drain) Steady State
Symbol
R thJA
R thJC
Typ.
43
9.5
Max.
55
12
Typ.
43
9.5
Max.
55
12
Unit
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Reliability Manual for profile. The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated)
as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to
ensure adequade bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 74406
S-81449-Rev. B, 23-Jun-08
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